1900 Series thermal conductive adhesive glue
●Thermal conductive adhesive glue Apply in COB, photovoltaic, semiconductor and other electronic and electric industry which have a higher request about the thermal conductivity.
Features and advantages:
● Thermal conductive adhesive glue bicomponent epoxy non-solvent adhesive with low thermal resistance;
● Room temperature curable with low shrinkage, can meet the technology requirement of precision,and have apreferable waterproof;
● Thermal conductive adhesive glue with strong adhesion and do not need screw;
● High stability and slow in thermal conductivity, can be long-term use under the condition of meet the need of thermal cycle.