Along with the gradually popularization of the 5 g in 5 g base stations, mobile phone and the server market, such as the cooling demand is upgrade from the quantitative change to qualitative change. 5 g base station step by step towards integration, intensification and development of miniaturization, and large amount of data processing, power consumption is about 2.5 ~ 4 times 4 g base stations; 5 g phones to lightweight, multi-functional and intelligent direction development, its power consumption compared with 4 g phones are also more than doubled, equipment of high integration demand for cooling materials and processing technology put forward higher requirements.
The base station is overheatingThe heat resulting from the high speed data transmission is transmitted to the external radiatorAttached to the base station heat source, absorb the base station heat, control the temperature
Data centerUsed to conduct heat between chip and radiatorPaste type thermal conductive glue, specially used to fill gaps, and has a high thermal conductivity
Communication terminalExtremely high transverse thermal conductivity, can quickly distribute heat evenly, so as to achieve the effect of heat dissipationAerospace polymer material, effectively reduce the heating temperature, improve the working time of equipment
Router heat dissipationThe core chip of the router is attached to fill the gap between the chip and the radiator to play the role of heat conductionSpraying on the surface of the metal shell can improve the heat dissipation effect by 15%~20%